If you are looking for high-quality products, please feel free to contact us and send an inquiry, email: firstname.lastname@example.org
custom sputtering targets are produced using materials such as aluminum nitride, boron carbide, calcium fluoride, cermets, magnesium oxide, nickel alloys, silicon nitride, tungsten carbide and zirconium oxide. Manufacturers can offer a wide variety of diameter, length & thicknesses. Capabilities include machining, grinding, drilling, lapping, micro hole drilling, slicing, slotting, dicing & prototyping.
The primary purpose of a sputtering target is to deposit a thin film on a substrate. This requires that the sputtering target have a uniform film thickness distribution on the substrate to enable an optimal deposition process. This can be a challenge in cases where the substrate is not a planar surface and the substrate has a complex geometry.
Sputtering targets are available in a variety of shapes and sizes and are fabricated through a number of manufacturing processes such as vacuum melting and rolling, hot pressing, special press-sintered and vacuum hot-pressed forged methods. They are suitable for use in a wide range of applications including heating elements, thermocouples, power and multichip modules, heat radiation plates, optoelectronic devices and thermally conductive fillers.
Some types of sputtering targets can also be manufactured into a circular flat disk form, and if desired, they can be supported or attached on a backing plate during further processing in the present invention. These types of products can be referred to as “disk type” or “HCM” style product.
A sputtering target manufacturing system according to various embodiments of the present teachings can comprise a plurality of sub systems designed and/or integrated to receive rough formed metal pieces and process them to their final form, as sputtering targets. The sub systems can be arranged at various stations, and the stations can be separated into one or more zones. The sputtering targets can be positioned in the zone for further processing at the stations. The stations can include a degrease and clean station, a cleaning sub system, and/or a drying sub system.